I've been able to handle the Pentium with 3 metal layers. The trick is that I can remove metal layers to see what is underneath, either chemically or with sanding. Shrinking feature size is a bigger problem since an optical microscope only goes down to about 800 nm.
I haven't seen any chips with a solid metal top layer, since that wouldn't be very useful. Some chips have thick power and ground distribution on the top layer, so the top is essentially solid. Secure chips often cover the top layer with a wire that goes back and forth, so the wire will break if you try to get underneath for probing.
Interesting! What is the reason of 800nm limit? I have successfully photographed my own designs down to 130nm with optical microscobes, though not with metal layer removal. The resolution isn't perfect but fearures were clearly visible.
The first thing I thought he was referring to is the wavelength of optical light, which is generally between 800-400nm IIRC. I take it your 130nm optical microscopes are imaging using ultraviolet?
Regardless, let's just get this man a scanning tunneling microscope already. :D
I haven't seen any chips with a solid metal top layer, since that wouldn't be very useful. Some chips have thick power and ground distribution on the top layer, so the top is essentially solid. Secure chips often cover the top layer with a wire that goes back and forth, so the wire will break if you try to get underneath for probing.