$6500!! You may as well buy 5x3090s for $1000 each for 120GB ram, spend the extra $1500 on the sundries.
Like, I'm sure Nvidia is aware of Apple's "unified memory" as an alternative to their cards and yet...they aren't offering >24GB consumer cards yet, so clearly they don't feel threatened.
Don't get me wrong, I've always disliked Apple as a company, but the M series chips are brilliant, I'm writing this on one right now. But people seem to think that Apple will be able to get the same perf increases yoy when they're really stretching process limits by dumping everything onto the same die like that - where do they go from here?
That said Nvidia is using HBM so it does make me wonder why they aren't also doing memory on package with HBM, I think SK Hynix et al were looking at making this possible.
I'm glad we're headed in the direction of 3d silicon though, always seemed like we may as well scale in z, I imagine they can stack silicon/cooling/silicon/cooling etc. I'm sure they can use lithography to create cooling dies to sandwich between everything else. Then just pass connections/coolant through those.
Like, I'm sure Nvidia is aware of Apple's "unified memory" as an alternative to their cards and yet...they aren't offering >24GB consumer cards yet, so clearly they don't feel threatened.
Don't get me wrong, I've always disliked Apple as a company, but the M series chips are brilliant, I'm writing this on one right now. But people seem to think that Apple will be able to get the same perf increases yoy when they're really stretching process limits by dumping everything onto the same die like that - where do they go from here?
That said Nvidia is using HBM so it does make me wonder why they aren't also doing memory on package with HBM, I think SK Hynix et al were looking at making this possible.
I'm glad we're headed in the direction of 3d silicon though, always seemed like we may as well scale in z, I imagine they can stack silicon/cooling/silicon/cooling etc. I'm sure they can use lithography to create cooling dies to sandwich between everything else. Then just pass connections/coolant through those.