No, they already do. None of the fabs (intel, tsmc, Samsung, etc.) build their own equipment. The secret sauce comes in designing the processes to integrate these machines into a cohesive months-long manufacturing process, building out the IP (aka what types of transistors and low-level features they can build) and so on. Companies like ASML and AMAT make machines with guarantees like “we can draw lines this small and deposit layers this thin” and it is up to intel or any other fab to figure out the rest.