I'm facing an engineering problem that amounts to stresses accumulating on the edges of a layered substrate. Are there any references, process notes, books, or industry approaches that you could point me to? High level and/or general are OK.
Lithography takes a more abstract approach to it, we are not actually calculating stresses, we have pretty powerful sensors which measure the wafer surfaces and then my department models the surface.
Lithography lives in the thin film approximation anyway. Timiosheko is a good reference. There are papers from Barnett or Nix that are very nice, but edges will probably end up a fem solver domain.
