Indeed. I have a very low power storage server with tons of ECC, and the better consumer grade NASes also tend to have it. Again, the issue here is its functionally limited to enthusiasts today because of cost and the average person being completely unaware of the impact.
My hope as we move into more advanced fabrication nodes is the increasing shift to HBM in the data center space starts to at least create an HBM option in the consumer side of things. I expect at least AMD to try that push in 2027 and beyond, and I’m sure Intel is looking hard at it too. Granted, Apple is already there with its higher end silicon.
Granted, I still expect there to be product line segmentation with ECC, as it’s a good lever to push a buyer into a higher end product. Though when it’s done on package, you at least eliminate the need for a main board to actually have the traces, and the external modules to have the extra memory. So it might be the easier route to get to more ECC in the consumer space, at least for mid-range and up personal computers.
My hope as we move into more advanced fabrication nodes is the increasing shift to HBM in the data center space starts to at least create an HBM option in the consumer side of things. I expect at least AMD to try that push in 2027 and beyond, and I’m sure Intel is looking hard at it too. Granted, Apple is already there with its higher end silicon.
Granted, I still expect there to be product line segmentation with ECC, as it’s a good lever to push a buyer into a higher end product. Though when it’s done on package, you at least eliminate the need for a main board to actually have the traces, and the external modules to have the extra memory. So it might be the easier route to get to more ECC in the consumer space, at least for mid-range and up personal computers.