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causality0 on Jan 22, 2023 | parent | context | favorite | on: AirJet – Solid-state chip for active device coolin...

We've seen the product, now time for the evidence. If they're right about their high pressure air stripping the insulating boundary layer from heat sinks it should be demonstrated with cooling benchmarks.

ilyt on Jan 22, 2023 [–]

...the ones they post on site linked?

Either way we'd have to wait till people in industry get their hands on test models

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