Most high end chips with high TDPs are already packaged upside down. You CPU, or... | Hacker News

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baybal2 on Aug 28, 2021 | parent | context | favorite | on: Next-gen chips will be powered from below

Most high end chips with high TDPs are already packaged upside down.

You CPU, or 9 out of 10 recent phone/tablet SoCs are all upside down chips.

https://en.m.wikipedia.org/wiki/Flip_chip

So, it's actually going to be an improvement from the thermals side, especially with TSVs carrying heat from the other side to the heatsink.

hinkley on Aug 29, 2021 [–]

The power layer is going to leak less power to heat than the other layers, correct? So the power rails will work as heat spreaders, if not particularly great ones.

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