One of the key misconceptions that I see repeated in the comments for this article is that lithography with sub-10nm feature size is somehow universally appropriate and preferable. This may be true for high-performance computing or other applications that are sensitive to the ratio of compute to price (or mobile consumer devices with a small thermal envelope), but it's not necessarily true for power electronics, automotive ICs, or missile control systems. Some of those chips aren't even made of silicon, instead being made of more expensive gallium nitride or gallium arsenide because of their thermal, high-frequency, radiation, and voltage properties.