> A TSOP package from one manufacturer manufacturer is not necessarily the same as a TSOP package from another.
Yeah, I've noticed this too. I now have to check the specific measurements (pin pitch etc) in the datasheets before buying, regardless of what the product page states about packages. I still on occasion make mistakes and get super tiny packages that I can't use without a pick and place machine...
This is mostly caused by both manufacturers and footprint library authors/EDA vendors using their own nomenclature for packages instead of the JEDEC standard names. This is especially apparent with gullwing SMD packages (anything from SO(IC) to LQFP) which are mostly same across manufacturers but vary widely in what they are called.
Yeah, I've noticed this too. I now have to check the specific measurements (pin pitch etc) in the datasheets before buying, regardless of what the product page states about packages. I still on occasion make mistakes and get super tiny packages that I can't use without a pick and place machine...