I mean, the issue is that you're not going to find the specifications for the PHY stuff anywhere. There's no model numbers to clone. It's literally things like how do you etch out capacitors in the fab's process? What's the electrical properties of their different dopants? There's not really any models to clone without cloning the whole fab.
Our best option IMO is to wait until Moore's law hits more of a standstill, when fabs become more of a commodity and they're less secretive about the underlying process rules.
We're not talking about achieving on-die chip speeds at the picosecond range here. We're talking about interface specifications between the CPU and the DRAM, USB, etc -- these things can be designed for based on specs, and you don't need a trise/tfall equal to 10% of your FO4 inverter delay to achieve this. These are board level specifications which can be achieved with medium tier off the shelf components. And if they can't be achieved at the latest DDRX specs, then just design for one generation behind to at least get something going in the community.
Our best option IMO is to wait until Moore's law hits more of a standstill, when fabs become more of a commodity and they're less secretive about the underlying process rules.