So it is meant to be a different architecture? What market is it targeting?
Is mill low power, high performance, embeded, radiation hardened, etc? Will it come in small packages with RAM and ROM on the die? Will it support a different architectural view (maybe all the memory will be non-volatile)?
A lot of questions and very little answered in the page.
Is mill low power, high performance, embeded, radiation hardened, etc? Will it come in small packages with RAM and ROM on the die? Will it support a different architectural view (maybe all the memory will be non-volatile)?
A lot of questions and very little answered in the page.